RE: RE: Lindon, etc28 Nov 2013 18:39
The competitive landscape looks very grim indeed. It is IMO one of the main reasons behind the sp drop considering that the drop really took on immediate substance after a set of pretty good results. I slowly but substantially reduced my holding a couple of days before the results simply because of what I perceived to be market sentiment built around the competition. I then got stopped out completely at 340. All back in now tho!! The problem with the competition is sorting fact from fiction. There is absolutely no doubt whatsoever that there has been a whole sea change in recent months. Some of that started behind the scenes last year but is only in recent months that it has become evident. The REAL competion is from the module assemblers. Under the new disruptive age Carclo ship the film, Atmel turn it into a sensor & then ship it to the module assemblers or ODM as they are called (asian)... they laminate it & send it to the OEM, he sticks it in his device & ships it to the shops. That's the supply chain we want to see & to do that we have to DISRUPT the order of business that has always previously been in place. As you can see the ODM guys won't be very happy chappies! They stand to lose a substantial part of their business to an outside sensor only manufacturer. They would become mere laminators!! SO... they fight back.. they do that in 2 main ways... 1) they now make their own mesh, I believe its mainly silver... turn it into a sensor & give it to the OEM & therefore by-pass an outsider!! A one stop shop for the OEM!!! 2) If the OEM insists on using an outside supplier the ODM charges the OEM lots more for the lamination to nullify the cost advantage that the outsider supposedly has over ITO. VERY difficult to overcome!!! As a direct result of the disruption the cost of ITO has fallen quite dramativly which adds to the problems. There are MANY other players who have joined in this fun too, most can probably be discounted but NOT all, some will be very worthy opponents, on top of that there are other innovations, Graphene, nanotubes, products with even sub micron lines.... all a long way off, but all adding to the flavour that Carclo might not have even an inch of space to play in. Where Xsense provides the differential from the rest of the competition is in its quality. It's ideally suited to the larger screen formats. ITO has sheet resistance issues & is not suitable for the larger touch screens. It's also brittle & it makes it very difficult to manufacture in larger sizes. Silver, whether mesh or nanowire has reflective issues which show as a haze around the edges & come to the fore in large sizes. Even Cambrios, who are the nanowire supplier to a number of other companies, say their offering is suitable for low to mid range devices. We don't know what the micron size of Carclo's lines are, all we know is that they are so fine that the opticle quality is 'unrecognisable' from the pre-validation un