RE: The problem25 Jun 2025 12:34
David Levi, CEO, commented: "Ethernity continues to progress its current strategy. At the time of the Company's previous fund raise in January of this year, we were still developing the technology for the new products, being the UEP with support for wireless link bonding, the XGSPON fiber controller technology subject to our $3 million contract signed at the end of 2021 and were at the initial stages of design of the Fiber-To-The-Room ("FTTR") PON devices for our $4.6 million contract as announced in September 2022. Subsequently, we have completed the release of the UEP link bonding system product, XGSPON FPGA code development, and the FTTR FPGA code development, therefore, I believe we have significantly de-risked the investment case as there is a clear line to the target revenues for this year as well as significant further growth potential for 2024 as customer deployments in the latter half of the year move to annualised deployments in 2024. The Placing contributes to the Company being financially positioned for the current requirements and contributes towards the anticipated mass deployment growth on existing contracts, as well as to capitalise on new opportunities."
· UEP - the Company has completed a release of the first version of the UEP link bonding product as announced on 20 March 2023;
· XGSPON - as announced on 6 March 2023, the XGSPON is complete and the Company has commenced shipment of its ENET5200 Quad XGS-PON System-on-chip (SoC) controller device to the customer in line with the contract terms. Further to this, the Company is in engagement and testing with potential substantial new customers; and
· FTTR controller technology development has been completed and is going out for testing with our customer and their customer in the coming weeks.
The Passive Optical Networking (PON) products, including XGS-PON Optical Line Termination (OLT) and Fibre-to-the Room (FTTR), were successfully factory tested, and the Company is progressing with the existing customer on deployment. The Company is engaged in further testing and discussions with other major OEMs for its PON fibre controller devices and PON systems over and above the current signed contracts. As a result, the Company will continue to target sales of licensing fees for its PON fibre controller System-on-Chip (SoC) and sales of its PON fibre controller OLT system in various configurations.
· First release of the UEP bonding product provided to our existing Bonding OEM customer, with the customer planning to commence field trials during Q3 2023 and initiate deployment during Q4 2023, followed by mass deployment during 2024.