RE: ENET29 Jan 2026 14:22
Recent business update π
"The Company is confident in its ability to secure a partnership for the ASSP opportunity.
Β· A long-standing OEM customer completed its second ASIC development earlier this year under the $800k agreement signed in November 2023. The Company anticipates increased royalty revenues from this engagement during 2026.
Β· Tier-1 U.S. PON vendors have placed an order for an additional 2,000 unit licenses.
Β· A Tier-1 U.S. defense and aerospace customer has successfully delivered a product to market based on the Company's IP. Close development collaboration continues, and the customer is expected to purchase additional platform-use licenses in 2026.
Β· The Company is expanding its FPGA portfolio with a new low-latency solution targeting Defence, Mobile, and Internet-of-Things (IoT) applications.
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Application-specific standard product ("ASSP") Opportunity
The Company remains confident in securing a partnership for the development of its planned ASSP device, which is designed to address large and diverse markets, including wireless backhaul through the integration of the Company patented L1 bonding, carrier ethernet, and broadband access through the combination of the PON functionality as a complete Optical Line Termination ("OLT") on a chip.
The ASSP will be architected as a true multi-platform solution, deployable across a wide range of systems such as cell-site routers, microwave backhaul Indoor Units ("IDU"), PON OLTs, compact carrier Ethernet switches, enterprise gateways, and 5G edge units. This broad applicability would create a strong foundation for large-scale commercial opportunities for both partners and OEMs. A growing number of leading OEMs have expressed interest in receiving the ASSP and acting as early adopters."