Ensilica Regulatory News (ENSI)

3 November 2025

EnSilica plc

("EnSilica", the "Company" or the "Group")

Project Progress Update and New Contract Awards

EnSilica plc (AIM: ENSI), a leading chip maker of mixed-signal ASICs (Application Specific Integrated Circuits), is pleased to provide an update on the continued progress across a number of its customer projects and new contract wins ahead of the annual results being published tomorrow.

· The six ASIC design and supply contract wins announced earlier in the financial year ended 31 May 2025 ("FY 2025") are progressing well and remain on track towards their tape-outs which are the next major milestones for each ASIC. One of these programmes has already achieved the successful tape-out of prototype analogue test circuits, validating key elements of the design ahead of full device completion expected mid-2026.

·  EnSilica has recently secured a number of new definition and feasibility study contracts, with confirmed orders totalling more than £1.6 million in revenue - should these engagements progress to full ASIC development and production, significant Non-Recurring Engineering ("NRE") and supply revenue over several years could result.

· Within the high growth space communications sector:

o  EnSilica has signed two new contracts with separate satellite service operators to include the requirements of their respective constellations in chips being developed as part of the C-LEO UK Space Agency programme.

o  EnSilica is currently engaged in three feasibility studies for satellite payload ASICs, with two for major satellite service operators and one for a satellite payload supplier. Each engagement has potential to progress to a multi-year, multi-million pound ASIC contract. One contract includes a recurring "per-satellite" monthly revenue model, in addition to significant ASIC royalties.

· A new contract has been won to develop an enhanced Radio Frequency (RF) vehicle tolling prototype chip, with the potential to lead to a long-term, high-volume supply agreement with an established European vehicle tolling systems provider.

· EnSilica has achieved a major shipment milestone of over ten million ASICs delivered for use in a premium automotive manufacturer's vehicles - the programme was secured in 2018 with shipments surpassing five million units in September 2024, and more than doubling volumes in a year underlines just how ASIC programmes can rapidly scale as well as drive strong recurring cash generations.

· The customer designed Edge Artificial Intelligence (AI) processing Chip referred to on 7 April 2025 announcement is now expected to tape-out in the second half of the current financial year.

· The Company's Design Services business unit is also in high demand with £1 million of repeat and new business booked in the past three months.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"EnSilica continues to execute strongly across our project portfolio, with a number of key programmes moving into the key implementation phases. The recent customer engagements and funded feasibility contracts further strengthens our design and supply pipeline, and highlights the strength of our highly differentiated technology offering in the space communications sector and Post Quantum Cryptography IP that spans all our focus sectors.

The 10 million shipment milestone achieved for our automotive customer highlights our ability to design and supply ASICs that not only meet the highest standards of reliability and safety but also scale rapidly to volume production for world-leading OEMs.

We will continue to capitalise on the continued demand for custom silicon across our key growth markets, which both underpins further cash flow alongside providing us with increasing confidence in the business.

We look forward to updating investors with our annual results to May 2025 when they are published tomorrow."

The person responsible for arranging release of this announcement on behalf of the Company is Ian Lankshear, Chief Executive Officer.

About EnSilica plc

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK, India, Brazil and Hungary.