Ensilica Regulatory News (ENSI)

27 November 2025

EnSilica plc

("EnSilica", the "Company" or the "Group")

AGM Statement

EnSilica (AIM: ENSI), a leading chip maker of mixed-signal ASICs (Application Specific Integrated Circuits), is holding its Annual General Meeting ("AGM") at 10.00 a.m. today. At the meeting, Mark Hodgkins, Chair, will make the following statement:

"I am pleased to report that EnSilica delivered important strategic progress across the year ended 31 May 2025 (the "Period"), securing six new ASIC design wins, reflecting both the breadth of customer demand and the strength of our position within the semiconductor value chain. We also almost doubled our chip-supply revenue, demonstrating the continued maturing of our production pipeline as more customer programmes transition from development into volume delivery.

However, we are nonetheless disappointed that overall revenues for the year declined, driven by customer-induced delays on two contracted projects, which impacted the timing of our NRE revenues. As our diverse portfolio of production programmes continue to build and as the new designs move to production, we expect our growing supply revenues to provide a natural buffer against the inherent lumpiness of the NRE revenues.

The team continues to deliver strong commercial momentum, with a significant and growing pipeline of opportunities across the Satellite Communications and Industrial sectors, alongside increasing adoption of our Post-Quantum Cryptography IP, which is now embedded across all of our focus markets. Based on chips already in supply and design contracts already secured, our expected lifetime production revenues are now estimated at approximately US$250 million, with a further US$469 million of opportunities under active pursuit. This momentum underpins the Board's confidence in the Group's near- to medium-term prospects.

The Company has continued to make notable customer progress in the high growth space communications sector. Over the period we were awarded two new user-terminal feasibility programmes for separate satellite-service operators, as well as having three ongoing feasibility studies for satellite payload ASICs. In addition, the Group achieved an important operational milestone, surpassing 10 million ASICs shipped into a premium automotive OEM's vehicle.

We recently announced the award of a UK Government contract to develop a quantum-resilient secure processor for critical national infrastructure applications. This programme enables us to advance the core cybersecurity technologies that underpin our product roadmap across our focus markets and is another key differentiator for the Company.

With recent new business momentum, including the $1.4 million satellite payload project booked earlier this week and a further €865,000 contract booked subsequently, the Company now has contracted visibility of more than 95% of FY 2026 consensus revenue forecasts and the Company remains well placed to achieve our FY 2026 guidance.

I would like to extend the Board's sincere thanks to our talented and dedicated staff across all our design centres worldwide. Their hard work, diligence and commitment have been fundamental to the progress we have made and to the opportunities now ahead of us.

EnSilica remains well placed as a premier European chipmaker with global reach as we seek to further capitalise on the continued demand for custom silicon across our key growth markets."

About EnSilica plc

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The Company is headquartered near Oxford, UK and has design centres across the UK, India, Brazil and Hungary.