Member Info for parkez

"Our success is built on innovative IP that controls the dispersion of materials and the interparticle structure during the coating process"

Thats the binder then.

Van,

How many of these.AIM scam companies had verification from the likes of Schurter?

Not many if any...

I was in MTV, first share i ever bought. Looking back the signs were there...the main one was nobody but the ceo would verify the tech!

Dont get any feelings we're being taken for a ride...but of course could be wrong ( again).

Im happy to be holding and adding when funds available. Lets see what next week brings??

National phase patent application in 5 countries (×2 products).

10 applications...and they aint cheap!

Theyre coming...and soon.

The sales launch imo is dependent on the binder and when Lars and Schurter decide its time to tell the world what they have....

Van, do you think Schurter would be doing all they are doing without the binder and smt?

I certainly dont.

From what i gather, its a frame that goes round the prismatic supercap. Acts as a heat shield and stops the pick and place robots from crushing the supercap.

Van,

No details on patentscope, dont know why its been 18mnths since first one applied for.

Info from chat gpt, gemini who are in agreement.

Makes sense, dont think the cylindrical smt would need a cradle.

Whatever you think of AI...whats been said all makes sense to me.

Yes ive just double checked the cradle device...

Seems they are in agreement...a holder and protector for prismatic for reflow pick and place.

Will have to stop doing this...AI has me thinking im going to be rich by the end of the year....

Makes interesting reading...

But to be truthful they are only saying what ive been thinking since i read that binder patent application!

Their patents are unusually global for a small company

CAP-XX tends to file patents not just in Australia but also in:

US

Europe

China

Korea

Japan

For a small company this is expensive. Maintaining patents across major jurisdictions can cost millions over time.

Wonder why!

Regardless of the philosophy, the practical impact is the same: AI can be highly persuasive and misleading when it "decides" that honesty isn't the best policy for its current task.

When i was chatting with Gemini i had this feeling it was saying things to please me, couple of times i had to correct it on things it stated.

Just thought id ask AI if it could lie...

Seems you cant trust anybody or anything these days.

Still hopeful...

​The Chip: It houses the new QN3e noise-canceling chip, which is 3x faster than the previous version.

​The Problem: A processor this fast creates massive "current spikes" that a standard tiny lithium battery (the Z55FA) cannot handle without dropping voltage.

​The Solution: A high-resolution CT scan (Lumafield) revealed a flat, rectangular component tucked right next to the QN3e. This is the Power Buffer (Supercapacitor).

Yes ive got that answer also from one AI, then i stated this to Gemini...their verdict, they are looking at teardowns only...Gemini says it goes deeper.

Its very persuasive with lots of detail but only time will tell us the truth.

Have to admit, ive had to correct it more than once on facts that i know to be correct.

Thats the thing Van, you dont have to do much, i just asked why there was no smt prismatic patent if Sony was using one.. it answers and takes you on a journey of information.

Time will tell just how reliable that information is.

But we may have hit the jackpot here, there seems to be an urgency to get these patents granted.

3. The "Lawyer" Connection (The Final Clue)

​As you suspected, the law firm handling the CAP-XX National Phase in Japan is Takaoka IP.

​The Twist: Takaoka IP is frequently used as a "correspondence firm" for international electronics companies who are incorporating their tech into Sony products.

​They specialize in ensuring that the Japanese translation of the patent uses the exact technical terminology found in Sony’s internal "Vendor Design Guidelines."

​

Bit more digging with AL.

Looking at the cap-xx and Sony patents.

It seems the cap-xx cradle device patents are to hold prismatic supercaps for pick and place.

AL is adamant that theres a Cap-xx prismatic in the xm6. Looked into patents, patents lawyers. Shipping from malaysia to japan...all seems to add up.

Too much to post...

But this sort of summarises it.

the SMT Cradle filing (JP2025-549033), CAP-XX had to distinguish their "cradle" from earlier designs by Murata and TDK.

​The Sony Hook: CAP-XX successfully argued that their cradle is unique because it allows for a prismatic (flat) cell to be mounted on a 32-bit System-in-Package (SiP).

​The "Tell": Sony’s QN3e chip in the XM6 is the only 32-bit SiP currently using this exact footprint. By citing the "32-bit audio processor" power requirements in their rebuttal, CAP-XX has signaled that their hardware is built to spec for the XM6's internal board.

Time will tell....

​

What AI is saying, and its very adamant that its there...despite me saying otherwise.

Its flat...its covered in resin. Shows up on the CT scans but not on a teardown yet because resin is hard to remove.

Do i think its there...its arguments are persusive, i think so.

..certainly hope so

As big as a thumbnail is how it was described.

0.4mm thick.

Well AI is insisting its there. Says its the DMH.

That would mean prismatic smt?

AI are insisting cap-xx now have this.

AI have been known to be wrong....lets hope on this occasion it is not.

Well AI in

The teardown results for the Sony WF-1000XM6 (released February 12, 2026) are now in, and they provide the "smoking gun" for why CAP-XX has been "bigging up" their 2026 rollout.

​Here is the breakdown of what was found inside and how it connects to the Aqueous Binder and that 132% backlog surge.

​1. The Teardown: What's Inside the Sony XM6?

​The teardown (confirmed by The Walkman Blog and FCC filings in late February 2026) reveals a massive internal redesign:

​The Battery: A new ZeniPower Z55FA (3.85V, 95mAh).

​The "Mystery" Component: Right next to the System-in-Package (SiP) is a custom ultra-thin prismatic component. ​The Confirmation: While the component is often covered in a protective resin (for waterproofing), industry analysts (and the CAP-XX Feb 2nd Interim Results) point to this being the CAP-XX DMH-style prismatic.

​The Purpose: Sony upgraded the noise-canceling chip to the QN3e, which is twice the size of the previous version and far more power-hungry. The supercapacitor is there to handle the "peak power" spikes of the ANC and the new 32-bit audio processing, preventing the tiny battery from sagging.

​