From November28 Mar 2025 14:38
One OEM has been testing the Ethernity universal edge platform ("UEP") during the year and the other OEM, that is familiar with Ethernity's technology from a previous engagement, has expressed an interest in co-funding the development of the ASIC, with a view to providing volume orders for the ASIC for a period of five years once it became available.
The Company is in meaningful discussions with several well-established Tier-1 third-party ASIC vendors that have expressed their interest in development of the ASIC and, should it commence, the Company plans to select one of them. This ASIC vendor would undertake the ASIC design work based on the Company's existing UEP product and semiconductor data processing technology that is available today on the UEP FPGA SoC.