PUR.L Regulatory News (PUR)

 PURE WAFER PLC

(AIM: PUR)

Result of AGM and Trading Update

27 November 2014

Pure Wafer plc ("Pure Wafer" or "the Company"), one of the leading global providers of high quality silicon wafer reclaim services to many of the world's largest semiconductor manufacturers and foundries as an integral part of their cost control programmes, announces that, at the Company's Annual General Meeting held on 26 November 2014, all resolutions put to shareholders were duly passed.

Dividend

The Board is pleased to confirm that, at the Annual General Meeting a final maiden dividend of 0.43 pence per ordinary share was approved for payment on 9 January 2015 to shareholders on the register at 28 November 2014.

The Board is also pleased to confirm that it intends to adopt a progressive dividend policy for future years, based on growth in earnings per share, to include both an interim and a final dividend with an approximate one third, two thirds split.

Trading Update

Trading continues to be strong and in line with market expectations.

Recent engagement with the Company's major customers in the US and Asia has been very positive. These high levels of customer satisfaction can be attributed to Pure Wafer's continued focus on providing the best possible customer service and support.

A further, and more detailed update on trading and the continued strength of the semiconductor market will be issued in January in line with previous announcements.